Abstract
A quantum-tunneling metal-insulator-metal (MIM) diode is fabricated by atmospheric pressure chemical vapor deposition (AP-CVD) for the first time. This scalable method is used to produce MIM diodes with high-quality, pinhole-free Al 2 O 3 films more rapidly than by conventional vacuum-based approaches. This work demonstrates that clean room fabrication is not a prerequisite for quantum-enabled devices. In fact, the MIM diodes fabricated by AP-CVD show a lower effective barrier height (2.20 eV) at the electrode–insulator interface than those fabricated by conventional plasma-enhanced atomic layer deposition (2.80 eV), resulting in a lower turn on voltage of 1.4 V, lower zero-bias resistance, and better asymmetry of 107.
Original language | English |
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Article number | 1805533 |
Journal | Advanced Functional Materials |
Volume | 29 |
Issue number | 7 |
DOIs | |
State | Published - 14 Feb 2019 |
Keywords
- MIM diode
- atmospheric pressure chemical vapor deposition
- barrier height
- conduction mechanism
- quantum tunneling
- spatial atomic layer deposition