Effect of post-annealing on grain boundary of nano-crystalline Cu processed by powder high-pressure torsion

Eun Yoo Yoon; Dong Jun Lee; Lee Ju Park; Sunghak Lee; Mohamed Ibrahim Abd El Aal; Hyoung Seop Kim

doi:10.1007/s11661-014-2466-z

Effect of post-annealing on grain boundary of nano-crystalline Cu processed by powder high-pressure torsion

Eun Yoo Yoon, Dong Jun Lee, Lee Ju Park, Sunghak Lee, Mohamed Ibrahim Abd El Aal, Hyoung Seop Kim

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

High tensile strength of 616 MPa and improved ductility of 7.6 pct were obtained in powder-consolidated pure Cu processed by high-pressure torsion (HPT) at room temperature followed by post-annealing at 673 K (400 °C). The powder-HPT consolidation process maintained nano-crystalline microstructures even after post-annealing due to the presence of well-dispersed oxide particles in the matrix. Higher ductility in the post-annealed specimen is attributed to higher fraction of stable ∑3 coincidence site lattice boundaries than that in the HPT-processed Cu.

Original language	English
Pages (from-to)	4748-4752
Number of pages	5
Journal	Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume	45
Issue number	11
DOIs	https://doi.org/10.1007/s11661-014-2466-z
State	Published - Oct 2014
Externally published	Yes

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title = "Effect of post-annealing on grain boundary of nano-crystalline Cu processed by powder high-pressure torsion",

abstract = "High tensile strength of 616 MPa and improved ductility of 7.6 pct were obtained in powder-consolidated pure Cu processed by high-pressure torsion (HPT) at room temperature followed by post-annealing at 673 K (400 °C). The powder-HPT consolidation process maintained nano-crystalline microstructures even after post-annealing due to the presence of well-dispersed oxide particles in the matrix. Higher ductility in the post-annealed specimen is attributed to higher fraction of stable ∑3 coincidence site lattice boundaries than that in the HPT-processed Cu.",

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T1 - Effect of post-annealing on grain boundary of nano-crystalline Cu processed by powder high-pressure torsion

AU - Yoon, Eun Yoo

AU - Lee, Dong Jun

AU - Park, Lee Ju

AU - Lee, Sunghak

AU - El Aal, Mohamed Ibrahim Abd

AU - Kim, Hyoung Seop

PY - 2014/10

Y1 - 2014/10

N2 - High tensile strength of 616 MPa and improved ductility of 7.6 pct were obtained in powder-consolidated pure Cu processed by high-pressure torsion (HPT) at room temperature followed by post-annealing at 673 K (400 °C). The powder-HPT consolidation process maintained nano-crystalline microstructures even after post-annealing due to the presence of well-dispersed oxide particles in the matrix. Higher ductility in the post-annealed specimen is attributed to higher fraction of stable ∑3 coincidence site lattice boundaries than that in the HPT-processed Cu.

AB - High tensile strength of 616 MPa and improved ductility of 7.6 pct were obtained in powder-consolidated pure Cu processed by high-pressure torsion (HPT) at room temperature followed by post-annealing at 673 K (400 °C). The powder-HPT consolidation process maintained nano-crystalline microstructures even after post-annealing due to the presence of well-dispersed oxide particles in the matrix. Higher ductility in the post-annealed specimen is attributed to higher fraction of stable ∑3 coincidence site lattice boundaries than that in the HPT-processed Cu.

UR - http://www.scopus.com/inward/record.url?scp=84906785891&partnerID=8YFLogxK

U2 - 10.1007/s11661-014-2466-z

DO - 10.1007/s11661-014-2466-z

M3 - Article

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SN - 1073-5623

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EP - 4752

JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

IS - 11

ER -

Effect of post-annealing on grain boundary of nano-crystalline Cu processed by powder high-pressure torsion

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